各类人形机器人、情感交互机器人、外骨骼机器人、仿宠物机器人、关键零部件、系统集成等产业链与应用服务

Humanoid robots, emotionally interactive robots, exoskeleton robots, robotic pets, key components, system integration , and related industrial-chain and application services.

各类机器人整机、A I终端、核心零部件、上下游供应链及场景应用等

Complete robot systems,AI terminals ,core components ,upstream and downstream supply chains ,and scenario-based applications.

精密减速器（谐波 / RV / 行星减速器）、无框力矩电机、空心杯电机、伺服驱动器、一体化关节模组、多自由度灵巧手、末端执行器、行星滚柱丝杠、编码器、力觉 / 视觉 / 触觉传感器、3D 相机、激光雷达、控制器、电源管理系统、专用电池、连接器、线缆、轴承等机器人核心执行与感知元器件。

Precision reducers (harmonic, RV, planetary reducers), frameless torque motors, coreless motors, servo drives, integrated joint modules, multi-DOF dexterous hands, end effectors, planetary roller screws, encoders, force/vision/tactile sensors, 3D cameras, LiDAR, controllers, power management systems, special batteries, connectors, cables, bearings and other core actuation & sensing components for robots.

机器人轻量化新材料、仿生高分子材料、结构性复合材料、特种合金、柔性传感材料、仿生皮肤材料；机器人精密加工、3D 打印、表面处理、成型工艺、检测设备、精密制造装备、无损检测、零部件测试验证技术。

New lightweight materials for robots, bionic polymer materials, structural composite materials, special alloys, flexible sensing materials, bionic skin materials; robot precision machining, 3D printing, surface treatment, forming processes, testing equipment, precision manufacturing facilities, non-destructive testing, component test & verification technologies.

机器人操作系统、运动控制算法、具身智能大模型、多模态感知算法、SLAM 导航、人机交互算法、机器视觉算法、轨迹规划、仿真开发平台、AI 算力芯片、边缘计算单元、大模型应用、机器人开发工具包、数字孪生系统。

Robot operating systems, motion control algorithms, embodied intelligent large models, multimodal perception algorithms, SLAM navigation, human-robot interaction algorithms, machine vision algorithms, trajectory planning, simulation development platforms, AI computing chips, edge computing units, large model applications, robot development toolkits, digital twin systems.

覆盖 IC 设计、EDA、晶圆制造、先进封装测试、半导体设备、第三代半导体、AI 芯片、算力硬件、车规半导体、半导体核心零部件、产业园投融资服务等完整产业链

Covering the entire semiconductor ecosystem, including IC design, EDA, wafer fabrication, advanced packaging and testing, semiconductor equipment, third-generation semiconductors, AI chips, computing hardware, automotive-grade semiconductors, critical semiconductor components, and industrial park investment and financing services.